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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA182B-1/230-A-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-L A182B-1/230-A-PF A 09 - Oct. - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA182B-1/230-A-PF Page 1/6
Package Dimensions
19.7 O3.2*16 5.0*3 2.40.5 12.12
YG
5.0
YG G YG G
YG G YG G
YG G
3.0
G
5.0
20.3
YG
5.0 2.5
YG G
3.20.3
G
0.5 TYP
6.40.5
G
2.54TYP +12
2
2.46TYP
G
4.50.5 8.30.5 10.20.5
1
Y
1 +
2
-
LYG2362/S10-PF
3.0
LG2340-1-PF
3.0
5.0 1.5MAX 1.5MAX
5.0
28.50.5
G Y
0.5 TYP
1.0MIN 2.54TYP
0.5 TYP
25.0MIN
G 2
1 1 2
1.0MIN 2.54TYP + -
1
2
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA182B-1/230-A-PF Page 2/6
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol Y Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature IF IFP PD Ir Topr Tstg 20 80 60 10 -40 ~ +85 -40 ~ +100 G 30 120 100 mA mA mW UNIT
A
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL Emitted GaAsP/GaP Yellow
COLOR
Peak wave length
Pnm
Forward Spectral voltage halfwidth @ 20mA(V) nm
Luminous intensity
@10mA(mcd)
Viewing angle 2 1/2 (deg)
Lens 585 White Diffused 565 565 35 30 30
Min. Max. Min. Typ. 1.7 1.7 1.7 2.6 2.6 2.6 1.8 1.8 8.0 4.0 4.0 20 100 100 80
LA182B-1/230-A-PF GaP GaP
Green Green Green Diffused
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA182B-1/230-A-PF Page 3/6
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
100 10 1.0
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0 0.9 0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA182B-1/230-A-PF Page4/6
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.5
Forward Current(mA)
100 10 1.0
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9 0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA182B-1/230-A-PF Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max
25 0
0
Preheat 60 Seconds Max
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA182B-1/230-A-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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